? semiconductor components industries, llc, 2016 october, 2016 ? rev. 11 1 publication order number: mbrd1035ctl/d mbrd1035ctl, nrvbd1035vctl, sbrd81035ctl series switch-mode schottky power rectifier dpak power surface mount package the mbrd1035ctl employs the schottky barrier principle in a large area metal?to?silicon power diode. state of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency switching power supplies, free wheeling diode and polarity protection diodes. features ? highly stable oxide passivated junction ? guardring for stress protection ? matched dual die construction ? may be paralleled for high current output ? high dv/dt capability ? short heat sink tap manufactured ? not sheared ? very low forward voltage drop ? epoxy meets ul 94 v?0 @ 0.125 in ? sbrd8 and nrvbd prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant mechanical characteristics: ? case: epoxy, molded ? weight: 0.4 gram (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? esd rating: ? human body model = 3b (> 8 kv) ? machine model = c (> 400 v) schottky barrier rectifier 10 amperes 35 volts 1 3 4 dpak case 369c marking diagram www. onsemi.com yww b10 35clg y = year ww = work week b1035cl = device code g = pb?free package see detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. ordering information
mbrd1035ctl, nrvbd1035vctl, sbrd81035ctl series www. onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 35 v average rectified forward current (at rated v r , t c = 115 c) per leg per package i o 5.0 10 a peak repetitive forward current (at rated v r , square wave, 20 khz, t c = 115 c) per leg i frm 10 a non?repetitive peak surge current (surge applied at rated load conditions, halfwave, single phase, 60 hz) per package i fsm 50 a storage / operating case temperature t stg, t c ?55 to +150 c operating junction temperature (note 1) t j ?55 to +150 c voltage rate of change (rated v r , t j = 25 c) dv/dt 10,000 v/ s stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. the heat generated must be less than the thermal conductivity from junction?to?ambient: dp d /dt j < 1/r ja . thermal characteristics rating symbol value unit thermal resistance, junction?to?case per leg r jc 3.0 c/w thermal resistance, junction?to?ambient (note 2) per leg r ja 137 c/w 2. rating applies when using minimum pad size, fr4 pc board electrical characteristics rating symbol value unit maximum instantaneous forward voltage (note 3) (see figure 2) per leg (i f = 5 amps, t j = 25 c) (i f = 5 amps, t j = 100 c) (i f = 10 amps, t j = 25 c) (i f = 10 amps, t j = 100 c) v f 0.47 0.41 0.56 0.55 v maximum instantaneous reverse current (note 3) (see figure 4) per leg (v r = 35 v, t j = 25 c) (v r = 35 v, t j = 100 c) (v r = 17.5 v, t j = 25 c) (v r = 17.5 v, t j = 100 c) i r 2.0 30 0.20 5.0 ma product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 3. pulse test: pulse width 250 s, duty cycle 2.0%
mbrd1035ctl, nrvbd1035vctl, sbrd81035ctl series www. onsemi.com 3 ordering information device package shipping ? MBRD1035CTLG dpak (pb?free) 75 units / rail sbrd81035ctlg* 75 units / rail mbrd1035ctlt4g 2,500 units / tape & reel nrvbd1035vctlt4g* 2,500 units / tape & reel sbrd81035ctlt4g* 2,500 units / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *sbrd8 and nrvbd prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable. typical characteristics figure 1. typical forward voltage per leg figure 2. maximum forward voltage per leg figure 3. typical reverse current per leg 1.10 0.10 v f , instantaneous forward voltage (volts) 100 10 v r , reverse voltage (volts) 35 0 100e-6 1e-6 i f , instantaneous forward current (amps) i 1.0 0.50 0.30 0.70 0.90 10 20 30 10e-3 100e-3 0.1 , reverse current (amps) r 1e-3 10e-6 t j = 25 c t j = 100 c t j = 125 c t j = - 40 c t j = 125 c figure 4. maximum reverse current per leg 1.10 0.10 v f , maximum instantaneous forward voltage (volts) 100 10 i f , instantaneous forward current (amps) 1.0 0.50 0.30 0.70 0.90 0.1 t j = 25 c t j = 100 c t j = 125 c 1e+0 t j = 100 c t j = 25 c v r , reverse voltage (volts) 35 0 100e-6 1e-6 10 20 30 10e-3 100e-3 1e-3 10e-6 t j = 125 c 1e+0 t j = 100 c t j = 25 c i , maximum reverse current (amps) r
mbrd1035ctl, nrvbd1035vctl, sbrd81035ctl series www. onsemi.com 4 figure 5. current derating per leg figure 6. forward power dissipation per leg figure 7. capacitance per leg 120 0 t l , lead temperature ( c) 8.0 7.0 5.0 6.0 4.0 v r , dc reverse voltage (volts) 25 0 105 85 75 65 0 v r , reverse voltage (volts) 100 10 i o , average forward current (amps) c, capacitance (pf) 3.0 2.0 1.0 60 20 40 80 100 140 30 35 5101520 95 115 125 510152025 0 t j , derated operating temperature ( c) 1000 t j = 25 c freq = 20 khz i pk /i o = i pk /i o = 20 dc square wave (50% duty cycle) i o , average forward current (amps) 1.0 0 4.0 3.0 2.0 1.0 0 2.0 p fo , average power dissipation (watts) 3.0 4.0 5.0 6.0 7.0 8.0 3.5 2.5 1.5 0.5 i pk /i o = 20 square wave (50% duty cycle) dc figure 8. typical operating temperature derating per leg * i pk /i o = 10 i pk /i o = 5 i pk /i o = 10 i pk /i o = 5 i pk /i o = r ja = 84 c/w r ja = 67.5 c/w r ja = 48 c/w r ja = 25 c/w r ja = 2.43 c/w * reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re- verse voltage conditions. calculations of t j therefore must include forward and reverse power effects. the allowable operating t j may be calculated from the equation: t j = t jmax ? r(t)(pf + pr) where r(t) = thermal impedance under given conditions, pf = forward power dissipation, and pr = reverse power dissipation this graph displays the derated allowable t j due to reverse bias under dc conditions only and is calculated as t j = t jmax ? r(t)pr, where r(t) = rthja. for other power applications further calculations must be performed.
mbrd1035ctl, nrvbd1035vctl, sbrd81035ctl series www. onsemi.com 5 figure 9. thermal response junction to case (per leg) figure 10. thermal response junction to ambient (per leg) 0.1 0.00001 t, time (s) 1.0 0.1 0.01 r 0.0001 0.001 0.01 , transient thermal resistance (normalized) (t) 1.0 10 100 1000 50%(duty cycle) 20% 10% 5.0% 2.0% 1.0% r tjl(t) = r tjl ? r (t) 0.1 0.00001 t, time (s) 1.0e+00 1.0e-01 1.0e-02 1.0e-03 1.0e-04 0.0001 0.001 0.01 1.0 10 100 10000 50% (duty cycle) 20% 10% 5.0% 2.0% 1.0% single pulse r , transient thermal resistance (normalized) (t) 1000 single pulse r tjl(t) = r tjl ? r (t)
mbrd1035ctl, nrvbd1035vctl, sbrd81035ctl series www. onsemi.com 6 package dimensions dpak (single gauge) case 369c issue f 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches scale 3:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* b d e b3 l3 l4 b2 m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.028 0.045 0.72 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within di- mensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 7. optional mold feature. 12 3 4 h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.114 ref 2.90 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw e bottom view z bottom view side view top view alternate constructions note 7 z on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mbrd1035ctl/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
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